FIELD: electrical engineering. SUBSTANCE: invention is related to methods of deposition of electric insulation compounds from melt. Compound includes 92-93 mass parts of oligoesterisocianuratamide with saponification number 295-345 mg KON/g and number of hydroxyl groups 7.0-8.5% and 7-8 mass parts of ethyleneglycol. Compound has product of interaction of dimethylterephtalate, $$$-diaminodiphenylmethane, trimellite anhydride and ethyleneglycol as oligoesterisocianurtimide, diethyleneglycol, tris (2-hydroxyethyl) of isocianurate and glycerine. In addition compound may include 25-40 mass parts of ether, ethyleneglycol and diethyleneglycol or their mixture. EFFECT: reduced temperature of deposition of compound on wire without any deterioration of quality of insulation. 3 cl, 3 tbl
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Authors
Dates
1997-05-27—Published
1993-12-23—Filed