FIELD: measurement technology. SUBSTANCE: sensor includes substrate on which working side there are deposited in sequence one above other first dielectric layer, resistive heating element, second dielectric layer, resistive gas sensitive element, resistive temperature sensitive element located in thermal zone of resistive heating and gas sensitive elements and electrically coupled to them. Resistive heating, temperature sensitive and gas sensitive elements form sensitive part of sensor. Termination pads of sensitive part are positioned beyond its limits and are connected to them by current conductive elements. Substrate has dead membrane-forming hole under sensitive part of sensor in side opposite to working side. Substrate is positioned on buffer heat-resistant layer in which through hole is made under dead membrane-forming hole in substrate equal in size to it, compensation grooves forming protrusions are made in mentioned layer o^ side fitting substrate. Dimensions and arrangement of protrusions coincide with projection of termination pads on buffer heat-resistant layer. EFFECT: enhanced operational efficiency and reliability of sensor. 2 cl, 3 dwg
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Authors
Dates
1997-10-20—Published
1994-04-25—Filed