COMPOSITE MATERIAL BASED ON COPPER ALLOY Russian patent published in 1997 - IPC

FIELD: electromagnetic screening, production of conductive glue for conductive circuits, for electrodes and stencil printing, for printing of resistive terminals. SUBSTANCE: given composite material includes: powder of copper alloy - 100.0 parts by weight produced by sputtering and having common formula Ag_xCu_y, where x and y are values of atomic relation selected from conditions 0.001 ≅ x ≅ 0,4;; 0.006 ≅ y ≅ 0,999; x+y=1, one or several organic binders - 5.0-200.0 parts by weight; additive capable of removal of copper oxide - 0.01-100.0 parts by weight. In this case concentration of silver on surface of each particle of powder of copper alloy is more than 2.1 times higher than average concentration of silver in particle. Each particle has region close to surface where concentration grows with decrease of distance from surface. EFFECT: proposed composite material has a number of distinguishing properties such as conductivity, resistance to oxidation and migration. 3 cl