FIELD: photolithographic processes. SUBSTANCE: positive photoresist applicable in manufacture of integrated circuits in microelectronics and radioelectronics contains, wt. -%: cresol- formaldehyde novolak resin, 60.0-66.5; diester of 1,2- naphtoquinodiazide-(2),5-sulfonic acid and 2,4-dihydroxybenzophenone, 3.0-33.0; organic compound possessing electronodonor properties and selected from series: p-dimethylaminobenzaldehyde, p- diethylaminobenzaldehyde, p-phenylenediamine, nitrosodiethylaniline, o-phenylenediamine, ferrocene, 2.0-9.0; and organic solvent, the balance. EFFECT: increased sensitivity to near UV emission and contrast and resistance in acidic media.
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SU1068879A1 |
Authors
Dates
1997-12-27—Published
1994-12-26—Filed