FIELD: electrolytic processes. SUBSTANCE: electrode contains (in g/l): nickel sulfate, 100-120; copper sulfate, 25-35; EDTA disodium salt, 40-50; aluminum sulfate, 20-30; and balancer (methyldiethylaminoethylalkylphenol polyglycol ether benzosulfate), 2.5-3.5. Depositing from the electrolyte allows obtaining bright, semiglittering coatings with high corrosion resistance. EFFECT: improved quality of coatings. 1 tbl
Title | Year | Author | Number |
---|---|---|---|
ELECTROLYTE FOR DEPOSITING COPPER-COBALT ALLOY | 1996 |
|
RU2101395C1 |
ELECTROLYTE FOR DEPOSITION OF COPPER-INDIUM ALLOY | 1998 |
|
RU2134734C1 |
ELECTROLYTE FOR DEPOSITION OF ZINC-ANTIMONY ALLOY | 1999 |
|
RU2156324C1 |
ELECTROLYTE FOR PRECIPITATION OF COBALT-BISMUTH ALLOY | 2001 |
|
RU2197567C1 |
ELECTROLYTE FOR DEPOSITION OF COPPER-CADMIUM ALLOY | 1998 |
|
RU2135645C1 |
BISMUTH-TIN ALLY PRECIPITATION ELECTROLYTE | 1999 |
|
RU2164967C1 |
ZINC-PLUMBUM ALLOY DEPOSITION ELECTROLYTE | 1997 |
|
RU2118671C1 |
ELECTROLYTE FOR DEPOSITING BISMUTH-LEAD ALLOY | 1996 |
|
RU2105830C1 |
ELECTROLYTE FOR DEPOSITION OF BISMUTH-MANGANESE ALLOY | 1997 |
|
RU2116389C1 |
ELECTROLYTE FOR DEPOSITING ARGENTUM-BISMUTH ALLOY | 2002 |
|
RU2215067C1 |
Authors
Dates
1998-03-10—Published
1996-07-22—Filed