FIELD: protective materials. SUBSTANCE: solution has, g/l: tin dichloride dihydrate, 8-20; thiourea, 35-45; sulfuric acid, 30-40; and volgonate, 0.5-1.0. Invention can be used in instrument making and radioelectronic industry for soldering and protection of articles made of copper and copper alloys using tin coatings. EFFECT: improved quality of coatings. 1 tbl
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