AQUEOUS SOLUTION FOR CHEMICAL DEPOSITION OF TIN ON COPPER OR COPPER ALLOY SURFACE Russian patent published in 2015 - IPC C23C18/31 

Abstract RU 2564190 C1

FIELD: chemistry.

SUBSTANCE: invention relates to instrument-making and radio electronic industry and can be used in conditions where there is need for a top coat on a high-planarity printed-circuit board or longer period of preserving the capacity for soldering, or corrosion protection of articles made of copper and copper alloys using tin-containing coatings, or as a resistive coating in copper and copper alloy etching processes. The aqueous solution for chemical deposition of tin coatings on a copper or copper alloy surface has components in the following ratio, g/l: tin dichloride dihydrate - 2-20, thiourea - 5-85, sulphuric acid - 5-75, fluorides - 0.1-100. The solution may contain ammonium fluorides and alkali or alkali-earth metal fluorides.

EFFECT: invention enables to obtain coatings on a copper or copper alloy surface, having improved appearance, physical-chemical and functional properties.

4 cl

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RU 2 564 190 C1

Authors

Pakhomov Nikolaj Petrovich

Borbat Vladimir Fedorovich

Dates

2015-09-27Published

2014-04-18Filed