FIELD: compact apparatuses for ultrasonic soldering. SUBSTANCE: apparatus includes drive unit 1, concentrator 7 with long and narrow soldering surface 8 and at least one reaction body 9. Length of apparatus is equal to wave half-length. Reaction body is coupled with concentrator through nodal plane defining zone for mechanically fixing members of apparatus. Reaction bodies are arranged around drive unit. Concentrator and reaction bodies are made of light metal. EFFECT: possibility of soldering narrow and long seams by means of small-size apparatus. 14 cl, 5 dwg
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