RADIO ELECTRONIC ASSEMBLY Russian patent published in 1999 - IPC

FIELD: radio engineering, in particular, design of electronic equipment for receiving and processing signals of satellite navigation systems. SUBSTANCE: device has multilayer printed circuit board, which has N conducting layers (6 or more). First and N-th conducting layers carry contact terminals and radio elements. Ground wires and power supply wires are located on different inner conducting layers and are designed as metal-coated strips which openings around metal-coated holes in connections between layers. Radio elements are grouped into M functional regions, one of which is functional region for analog elements, other functional regions are designed for digital elements. All M functional regions on outer first and N-th conducting layers contain signal wires of these regions. Functional region for analog elements has ground strips for this region on two inner layers of printed circuit board (second and (N-1)-th). Analog power supply strip is located in one of inner conducting layer which is adjacent to second or (N-1)-th layer. In all M-1 functional regions for digital elements, one of inner conducting layers of printed circuit board, which is adjacent to first or N-th outer conducting layer, contains separate ground strip of respective functional regions. One of inner conducting layers of printed circuit board, which is split by at least one conducting layer from layer with ground strips of functional regions of digital elements contains separate isolated strips for digital power supply of these regions. Strips for power supply of analog and digital functional regions do not overlap in vertical direction. Each of M functional regions has contact terminals for connection to external power supply separated according functional regions. Said contact terminals are located on one of external conducting layers of printed circuit board and are connected to corresponding power supply strips of these functional regions. Electrical connections between M functional regions are achieved by means of signal conductors, which are designed as straight line printed conductors, which are located on external conducting layer which is adjacent to inner conducting layer, in which ground strips of all M functional regions are located. Signal conductors are connected to between contact terminals, which are located on edges of respective functional regions. Ground strips of all M functional regions which are located in inner conducting layer, which is adjacent to external conducting layer with signal conductors, are connected by means of straight line ground by-passes, which are located under signal conductors and have width of at least 1mm. EFFECT: decreased parasitic induction and noise in cases when printed circuit board carries functional elements which have different functions, differ in integration level and operating with signals of different frequencies. 8 dwg