FIELD: chemical industry, more particularly manufacture of electroinsulating materials. SUBSTANCE: heat-resistant material comprises (wt %): inorganic filler, the balance, up to 100; cross-linking agent, 0.25-2.25; organosilicon block copolymer of general formula: wherein x is 2-3, n is 5-40, m is 5-40, 3-45. Inorganic filler includes fiber glass fabric, mica paper, sheet mica or mixtures thereof. Inorganic filler further comprises beryllium oxide, silicon nitride, boron nitride, aluminium nitride or mixtures thereof and/or discrete cloth. 1st variant comprises impregnating inorganic filler with organosilicon binder, drying, hot pressing and heat treating it at 260-400 C. 2nd variant comprises mixing heat-resistant powder-like inorganic filler with organosilicon binder, drying, rolling, hot pressing and heat treating it at 260-400 C. EFFECT: heat-resistant polymeric material having high electrical strength which does not become poor when polymeric material is heated to 300-350 C. 8 cl, 2 tbl
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Authors
Dates
1999-04-20—Published
1998-06-04—Filed