FIELD: polymers. SUBSTANCE: invention describes heat-shielding polymeric material comprising inorganic filling agent and polymeric matrix based on organosilicon block-copolymer and cross-linking agent wherein heat-shielding polymeric material comprises organosilicon block-copolymer as polymeric matrix of the general formula: OH{(C6H5SiO1.5)m[(CH3)2SiO]n}H wherein m = 5-10; n = 15-25 in the following ratio of components, mass p. p.: inorganic filling agent, 17-56; organosilicon block-copolymer, 20- 60; tin diethylcaprylate, 1-4; oligoorganosiloxane, 10-30. Method for making heat-shielding polymeric material involves impregnation of inorganic solvent with polymeric matrix, drying, thermal treatment at temperature 50-80 C. Invention provides reducing density value and hardening temperature of heat-shielding material and possibility for its exploitation below temperature 400 C. EFFECT: improved preparing method, valuable properties of material. 4 cl, 2 tbl, 6 ex
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Authors
Dates
2003-12-27—Published
2001-10-08—Filed