FIELD: building industry, electrical engineering and electronics. SUBSTANCE: hardener is 1-aminopyrolidine or salt thereof. Epoxy resin is hardened by said hardener at low temperatures (10 C or lower) for sufficiently short time. Epoxy resin-based adhesive composition comprises 0.4-0.6 per mole epoxy group of 1-aminopyrolidine or salt thereof. Coating composition comprises epoxy resin, said hardened and 20-160 wt. pts per 100 wt. pts of epoxy resin and/or reinforcing fillering. Hardened products have improved electroinsulating, and strength properties, chemical resistance and heat resistance. EFFECT: improved properties of hardener, adhesive composition and coating composition. 7 cl, 6 ex, 2 tbl
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Authors
Dates
2002-01-20—Published
1999-04-28—Filed