FIELD: electronics. SUBSTANCE: invention deals with multipurpose photopolymerizing composition containing, per cent by weight: butyl acrylate 40.0-20.0; butylmetacrylate 35.0-30.0; nitrilacrylic acid 15.0- 5.0; methylmetacrylate 20; 0-0; metacryl acid 20.0-15.0; phthalocyanine pigment in the amount of 1.0-2.0 per cent of weight of specified acrylic copolymer and following additional components, per cent of weight of specified acrylic copolymer: glycidilmetacrylate 10.0-5.0; triethyleneglycol-metacrylate 20.0-10.0, α-chloroanthraquinone 0.1-0.05; dimethylbenzylketal 6.0-4.0; hydroquinone 0.1; monomethylester of hydroquinone 0.1; zinc acetate 0.03-0.01; ethylenglycol 8.0-4.0; sulfuric acid 0.01; metacrylaremethyldyetoxysilane 15.0-7.0 which form heterocyclic structure of polymer part of soldering mask in process of thermal and photopolymerization. In addition composition can contain magnesium oxide in the amount of 0.01-2.0 per cent by weight of acrylic copolymer. EFFECT: enhanced operational characteristics, that is, thermal stability, resolving power, efficiency of composition in process of its storage up to moment of its usage. 2 c, 2 tbl
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Authors
Dates
2002-11-10—Published
2001-03-01—Filed