FIELD: laser treatment, in particular, method and device for cutting of films, applicable in manufacture of films consisting of base and decorative layer. SUBSTANCE: at cutting, first the decorative coating is removed from the film base by laser radiation. Then, the film base is cut by a knife in the obtained track that is wider than the knife width. The device has a laser and a cutting knife located behind the place of action of the laser beam. Since first only the decorative coating is removed, there is a possibility to use small, relatively, cheap lasers. EFFECT: prevented wear of the cutting tool. 13 cl, 4 dwg
