THERMOSETTING RESIN COMPOSITION (VERSIONS), CONSTRUCTION OF ATTACHMENT OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE OF SEMICONDUCTOR DEVICE WITH USE OF THERMOSETTING RESIN COMPOSITION Russian patent published in 2002 - IPC

FIELD: thermosetting resins used as sealants quickly filling voids in semiconductor devices, such as flip chip unit which includes semiconductor chip secured on carrier substrate ensuring reliable connection of semiconductor with mounting plate at thermal hardening. SUBSTANCE: thermosetting resin composition which is used as sealant between semiconductor device and mounting plate to which this device is electrically connected includes epoxy component and latent hardening agent which includes ester cyanate component and imidazole component. EFFECT: increased rate of hardening; protracted working life; enhanced adhesion properties. 17 cl, 1 dwg, 2 ex