FIELD: technological processes.
SUBSTANCE: resin-enriched outer layer is applied to the curable resin-based composite substrate with the subsequent cocuring. After cocuring, the composite substrate is completely cured, and the matrix resin in the outer layer remains partially cured. After removal of the outer layer, a rough surface which is capable to bond with chemically active functional groups opens up. A composite substrate with a chemically active, capable to bond surface can be connected to another composite substrate to form a covalent-bonded structure.
EFFECT: proposed outer layer is designed so that it can be applied to various composite substrates such as prepregs to modify their surfaces and provide improved adhesion and bonding properties.
18 cl, 11 dwg, 6 tbl, 5 ex
| Title | Year | Author | Number |
|---|---|---|---|
| CONNECTION OF COMPOSITE MATERIALS | 2015 |
|
RU2708209C2 |
| COMPOSITE MATERIALS BONDING | 2013 |
|
RU2618055C2 |
| WATER PRIMER COMPOSITION FOR IMPROVED FILM-FORMATION AND METHODS OF ITS APPLICATION | 2014 |
|
RU2638973C2 |
| PRESERVATION OF COMPRESSION STRENGTH OF THERMOPLASTIC EPOXY COMPOSITES IN HOT AND HUMID CONDITIONS | 2018 |
|
RU2720793C1 |
| RESIN COMPOSITION | 2015 |
|
RU2705724C2 |
| COMPOSITE MATERIAL WITH POLYAMIDE PARTICLES | 2013 |
|
RU2625241C2 |
| METHOD OF PROCESSING SURFACES AND/OR JOINTS THEREOF | 2006 |
|
RU2395537C2 |
| COMPOSITE MATERIALS CONTAINING CONDUCTING NANOFILLERS | 2012 |
|
RU2611512C2 |
| COMPOSITE MATERIALS FROM THERMO-REACTIVE RESIN CONTAINING INTER-LAYER PARTICLES INCREASING STRENGTH | 2013 |
|
RU2641004C2 |
| COMPOSITE MATERIALS WITH HIGH SPECIFIC ELECTRIC CONDUCTIVITY IN Z-DIRECTION | 2015 |
|
RU2702556C2 |
