CONNECTOR DISTINGUISHED BY HIGH-DENSITY DISPOSITION OF COMPONENTS AND ITS MANUFACTURING PROCESS Russian patent published in 2003 - IPC

FIELD: electrical engineering; setting up electronic equipment circuits on substrates using ball net matrix technique. SUBSTANCE: outer surface of connector member has at least one notch. Electric contact is provided between adjacent inner surface of connector member and notch on its outer surface. Amount of solder-material under check is inserted in notch that accommodates fusible conducting member in the form of solder ball. Connector is heated to temperature required for melting process to solder ball to part of contact running to mentioned notch. Contacts are secured in insulating shroud of connector with aid of deformable members that function to minimize stresses induced on central parts of contacts to ensure uniform soldering. EFFECT: enhanced reliability and efficiency of surface wiring; high disposition density of components on substrate. 6 cl, 48 dwg, 5 tbl, 4 ex