FIELD: electrical engineering. SUBSTANCE: proposed method for depositing metal coating on polymeric-surface substrates for producing thin-structure printed-circuit boards with microscopic holes includes covering surface with electricity conducting polymeric layer followed by metal deposition; electricity conducting polymer used for the purpose is poly-3.4- ethylene hydroxithiophenon; prior to metal deposition it is brought in contact with copper (II) salt solution. EFFECT: improved bonding between conducting film and polymeric substrate; enhanced material growth of copper. 4 cl, 1 tbl
