PROCESS OF ACTIVATION OF DIELECTRIC SURFACES Russian patent published in 1997 - IPC

FIELD: technology of activation of surfaces of dielectrics before chemical and/or electrochemical deposition of coats, manufacture of printed-circuit boards, flexible printed cables, flat offset printed forms and nonselective deposition of coats on plastics and ceramics. SUBSTANCE: surface of dielectric is subjected to degreasing, to subsequent treatment in aqueous-ammonia solution of phosphorus-containing copper salt, to filtration of solution, to thermal treatment and rinsing of surface of dielectric. Drying of substrate with deposited activating solution is conducted prior to thermal treatment and ammonia is added into solution of phosphorus- containing copper salt after filtration. Activating solution is taken in following mole relation Cu²⁺:NH₃ 1:0:3.5-4.0. EFFECT: increased operational efficiency of proposed process. 1 dwg, 2 tbl