METHOD FOR COPPER ELECTROPLATING OF SUBSTRATES Russian patent published in 2004 - IPC

FIELD: copper electroplating of substrates using insoluble anodes in acid baths and separate supply of copper ions. SUBSTANCE: proposed method involving production of copper sulfate electrolyte characterized in reduced adverse changes in organic dopes and in that use of diaphragms and additional electrolyte is dispensed with includes introduction of consumable copper ions into working electrolyte, their main quantity being injected directly in the form of copper carbonate and/or main copper carbonate in separate tank and bypassed to working electrolyte. Liberated gaseous CO₂ is separated in separate tank. Copper plating baths are filled with polymers obtained by polymerization of bifunctional propane derivatives with one or more unsaturated spirits with three to ten atoms of carbon and one or more double and/or triple bonds which are used as organic components. Copper salt solution is neutralized prior to precipitation of copper carbonate by means of caustic soda to pH value lower than that required for settling down copper hydroxide. EFFECT: improved quality of copper sulfate electrolyte and reduced cost of copper ions regeneration. 4 cl, 1 ex