ELECTRONIC CONTROL PACKAGE Russian patent published in 2003 - IPC

FIELD: electronic engineering; packages with printed-circuit boards and plug connectors for computer units and the like. SUBSTANCE: electronic package has set of printed-circuit boards with contact pads, board-to-board connector with spring contacts which are disposed between printed-circuit boards and are engageable with contact pads, as well as members securing this set in position; in addition it is provided with at least one isolating frame that functions to isolate circuits of all series- connected printed-circuit boards of package through spring contacts to form all-in-one sections and is disposed between two electrically interconnected printed-circuit boards. EFFECT: reduced size and mass, enlarged functional capabilities. 1 cl, 2 dwg