RADIO ELECTRONIC ASSEMBLY Russian patent published in 1999 - IPC

FIELD: radio engineering, design of packet-type assemblies, which comprise printed circuit boards and electric sockets in particular, for multiple-channel communication, computer engineering. SUBSTANCE: device has set of printed circuit boards with adjacent contact regions on front and back sides of boards in set, terminal blocks which are made from insulation material, have spring-loaded contacts, are located between printed circuit boards and interact with contact regions on boards, and set fixing members. Contact regions are provided in recesses of printed circuit boards with coaxial transient metal-coated holes and are covered with layer of plastic current-conducting protection material in which external shape of cross section of said layer of plastic current-conducting protection material is concave with curvature. EFFECT: increased reliability, decreased resistance of electric connection between boards, increased functional capabilities due to decreased step between contacts and resistance to external negative mechanical and weather disturbances. 7 cl, 2 dwg