FIELD: protective coatings. SUBSTANCE: composition is used for forming thin hydrophobic coatings on surface of copper alloys, for example when protecting heat-exchange apparatuses. Composition including epoxyamine adduct modified by low-molecular unsaturated diethyl malonate-based polyester and neutralized by formic acid, as well as water dispersion of fluoroplastic (polytetrafluoroethylene or hexafluoroethylene) stabilized by oxyethylated nonylphenol, all in specified proportions. EFFECT: increased in-use stability. 2 tbl, 9 ex
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