FIELD: electronic engineering, in particular, manufacture of multipin vacuum-tight metal-ceramic legs for electric vacuum devices for various purposes.
SUBSTANCE: method involves using materials having similar thermal expansion coefficients; providing at least two ceramic parts, one of parts being provided with opening; soldering pins in openings by means of glass solder placed in continuous layer between parts with pins passing through openings of said parts; to simplify filling of gaps between opening walls and pins with glass solder, preliminarily filling opening in one of parts with powdered glass solder having maximal particle size not in the excess of half the size of gap; applying specific pressure of about 30-50 g/cm2 to one of ceramic parts during soldering process. Method allows almost 100% yield of legs comprising 76 pins of 0.6 mm diameter in ceramic part of 18.5 mm diameter to be provided. Legs are vacuum-tight for vacuum of 10-10 ml of mercury column at temperature of 4500C.
EFFECT: simplified process, enhanced reliability and improved vacuum tightness of soldered joint.
1 ex
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Authors
Dates
2004-06-27—Published
2002-06-17—Filed