FIELD: electroplating, possibly deposition of coatings with high corrosion resistance in machine engineering.
SUBSTANCE: electrolyte for deposition of cadmium-antimony alloy contains cadmium and antimony chlorides, Trilon, aluminum chloride, polyethylene glycol ether of high-molecular alkyl phenols and smoothing agent (benzene sulfate of methyl diethyl amino-methyl polyglycol ether of alkyl phenol) at predetermined relation of components.
EFFECT: possibility for depositing uniform semi-bright coatings with high corrosion resistance.
Title | Year | Author | Number |
---|---|---|---|
ELECTROLYTE FOR DEPOSITION OF ZINC-ANTIMONY ALLOY | 1999 |
|
RU2156324C1 |
ELECTROLYTE FOR SEDIMETATION OF ALLOY INDIUM-ANTIMONY | 2008 |
|
RU2359073C1 |
ELECTROLYTE FOR DEPOSITION OF COPPER-CADMIUM ALLOY | 1998 |
|
RU2135645C1 |
ELECTROLYTE FOR DEPOSITING BISMUTH-LEAD ALLOY | 1996 |
|
RU2105830C1 |
BISMUTH-TIN ALLY PRECIPITATION ELECTROLYTE | 1999 |
|
RU2164967C1 |
ELECTROLYTE FOR DEPOSITION OF BISMUTH-THALLIUM ALLOY | 2005 |
|
RU2291917C1 |
ZINC-PLUMBUM ALLOY DEPOSITION ELECTROLYTE | 1997 |
|
RU2118671C1 |
ELECTROLYTE FOR DEPOSITION OF NICKEL-BISMUTH ALLOY | 2011 |
|
RU2457287C1 |
ELECTROLYTE FOR PRECIPITATION OF COBALT-BISMUTH ALLOY | 2001 |
|
RU2197567C1 |
ELECTROLYTE FOR DEPOSITING BISMUTH-INDIUM ALLOY | 0 |
|
SU1618786A1 |
Authors
Dates
2004-09-20—Published
2002-12-09—Filed