FIELD: manufacturing of copper coating, in particular for metallization of printing plates used in radio engineering.
SUBSTANCE: invention relates to method of chemical reduction for copper coating from solution. Claimed solution with increased stability contains: five-hydrous copper sulfate 10.0-15.0 g/l; potassium-sodium tartrate 50.0-60.0 g/l; nickel chloride 2.4-4.0 g/l; sodium carbonate 2.0-4.0 g/l; sodium hydroxide 13.0-15.0 g/l; formaldehyde (37%) 10.0-15.0 ml/l; thiourea 0.001-0.003 g/l; potassium ferricyanide 0.03-0.05 g/l; and distilled water up to 1 l.
EFFECT: chemical copper coating with quality required for further electrodeposition; improved environmental compatibility; reduced chemical reagent consumption and labor intensity due to multiple reusing of solution.
2 tbl, 5 ex
| Title | Year | Author | Number |
|---|---|---|---|
| HIGHLY STABLE SOLUTION FOR CHEMICAL COPPER PLATING OF PCB HOLES | 2022 |
|
RU2792978C1 |
| AQUEOS SOLUTION FOR CHEMICAL COPPER PLATING | 0 |
|
SU983149A1 |
| CHEMICAL COPPER PLATING SOLUTION | 1992 |
|
RU2069457C1 |
| STABILIZER OF CHEMICAL COPPER-PLATING SOLUTIONS | 0 |
|
SU1067080A1 |
| SOLUTION FOR CHEMICAL COPPER-PLATING OF DIELECTRICS AND METALS | 0 |
|
SU566890A1 |
| SOLUTION FOR CHEMICAL DEPOSITION OF COMPOSITION TYPE COPPER COATINGS | 2005 |
|
RU2283895C1 |
| SOLUTION FOR CHEMICAL COPPERING | 0 |
|
SU575379A1 |
| AQUEOUS SOLUTION FOR CHEMICAL COPPER PLATING | 0 |
|
SU1138433A1 |
| 0 |
|
SU263352A1 | |
| 0 |
|
SU497359A1 |
