THERMOMETER SYSTEM AND METHOD FOR MANUFACTURING DATA INTEGRATED CIRCUIT FOR THERMOMETER SYSTEM Russian patent published in 2005 - IPC

FIELD: heat measuring devices displaying extreme temperature conditions of functional equipment.

SUBSTANCE: proposed thermometer system has data integrated circuit and external measuring circuit. Data integrated circuit has base that carries fast-response and lagging heat-sensing elements built around thermistors mounted on solid-body substrate and used for measuring temperature of medium and wall of location under check, respectively, as well as power leads for connecting heat-sensing elements to external measuring circuit. The latter is provided with comparison unit and display unit. Fast-response heat-sensing element is connected to first input of display unit and lagging one, to second input of comparison unit. Substrate is made of semiconductor material. Newly installed in external measuring circuit are adder as well as first and second transducer amplifiers. Fast-response heat-sensing element is connected to first input of comparison unit and to that of adder through first transducer amplifier. Lagging heat-sensing element is connected to second input of comparison unit through second transducer amplifier. Comparison unit output is connected to second input of adder and output of the latter, to input of display unit either directly or through switching unit. Method for manufacturing data integrated circuit includes formation of thermistors of fast-response and lagging heat-sensing elements on solid-body substrate, attachment of heat-sensing elements to integrated circuit base, and their connection to power leads of external measuring circuit. Thermistors are formed by applying thermistor layer onto semiconductor substrate followed by forming microprofiles. Metal is deposited on contact pads and the latter are connected to respective heat-sensing elements. Substrate section to suit location of fast-response heat-sensing element is removed or blind hole is etched therein and contact pads are connected to power leads embedded in integrated circuit base.

EFFECT: enhanced descriptiveness and sensitivity of target part; reduced size.

3 cl, 5 dwg, 2 tbl