FIELD: chemistry, in particular organic polymeric compounds and compositions.
SUBSTANCE: claimed composition contains epoxy-dianic resin with molecular weight at most 390, aliphatic epoxy resin, and triethyleneamin as curing agent. Composition is obtained by addition of 5-10 mass pts of aliphatic epoxy resin to 100 mass pts of epoxy-dianic resin and mixture is blended to obtain homogeneous mass. Then 13-14 mass pts of triethyleneamin as reduced to 100 mass pts of resin is admixed and cured at room temperature for one day followed by auxiliary curing at 100-120°C for 3-5 h. Composition of present invention is useful in production of heat resistant polymeric constructional materials for aerospace and machine industry.
EFFECT: epoxy compositions with improved strength and heat resistance.
2 cl, 3 tbl, 3 ex
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Authors
Dates
2005-05-10—Published
2003-05-21—Filed