FIELD: organic chemistry of high-molecular compounds.
SUBSTANCE: invention relates to composition based on organic high-molecular compounds. Invention proposed epoxy composition comprising the following components, mas. p. p.: epoxy-diane resin, 100; polyethylene polyamine, 10, and copper electrolytic powder with nominal size of particles 0.22 mm, 150-200. The prepared composition can be used in different branched of machine engineering. Invention provides enhancing wear resistance of epoxy composition for possibility of broader usage of the composition in machine engineering.
EFFECT: improved and valuable properties of composition.
1 tbl
Title | Year | Author | Number |
---|---|---|---|
EPOXY COMPOSITION | 1999 |
|
RU2154658C1 |
EPOXIDE COMPOUND | 2009 |
|
RU2424258C1 |
ANTIFRICTION EPOXY COMPOSITION | 0 |
|
SU657042A1 |
COMPOSITION FOR ANTIFRICTION COATINGS | 2004 |
|
RU2272052C1 |
PROTECTIVE COATING COMPOSITION | 2009 |
|
RU2402585C1 |
FRICTION COMPOSITION | 0 |
|
SU1835406A1 |
ANTIFRICTION POLYMER COMPOSITION AND METHOD OF PRODUCING SAID COMPOSITION | 2008 |
|
RU2374275C1 |
POLYMER COMPOSITION | 2002 |
|
RU2221824C1 |
POLYMERIC COMPOSITION FOR ANTICORROSIVE PROTECTION OF WELDED JOINTS | 2004 |
|
RU2273653C1 |
PROTECTIVE COATING COMPOSITION | 2008 |
|
RU2394861C1 |
Authors
Dates
2005-06-27—Published
2003-12-29—Filed