FIELD: heating systems.
SUBSTANCE: proposed heating system includes semiconductor heating unit, heat accumulating wall located between glazing and unit and temperature controller. Mounted in upper part of wall is rectangular passage with drop valve; thermal tubes are mounted in horizontal position in center part of wall; heat accumulating capsules mounted in vertical position on side of glazing are filled with heat accumulating agent changing its aggregate state within working temperature range; drop valve is mounted in lower part of unit on side of wall; temperature controller mounted in room is electrically connected through pulse lines with room temperature sensor and outside temperature sensor, as well as with electric motors of fans and thermoelectric battery.
EFFECT: saving of electric power; ease in servicing and control.
1 dwg
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Authors
Dates
2005-10-20—Published
2003-11-21—Filed