FIELD: the invention refers to the means of protection of microelectronic recorders of information and may be used in protected airborne storage devices of flight information of aircraft and helicopters.
SUBSTANCE: the protection of microelectronic equipment from destructive factors in accord with the invention is executed by means of polylayer shell holding successively located deep into protective layers: an exterior, an intermediate and an interior and also a bimorph heat-protecting covering of the exterior layer. At that each layer and covering fulfill a definite protective function. The bimorph thermal protective covering designed for passive thermal protection of the recorder provides it due to sharp growth of volume and the degree of porosity of material of the covering at thermal influence on it with flame leading to substantial increasing of the thickness and thermal resistance of the covering. The exterior layer is designed for securing protective burst-heat toughness. The intermediate layer designed for passive thermal protection of the guarded object fulfills functions of thermal insulator. The interior layer provides active thermal protection of the microelectronic recorder. For this purpose it is formed out of crystalline compounds having crystalline water.
EFFECT: effective protection of the guarded object.
1 cl, 1 dwg
Title | Year | Author | Number |
---|---|---|---|
ONBOARD DEVICE FOR THERMAL AND MECHANICAL PROTECTION OF MICROELECTRONIC OBJECT | 2004 |
|
RU2269169C1 |
DEVICE FOR THERMAL AND MECHANICAL PROTECTION OF OBJECT | 2004 |
|
RU2269170C1 |
DEVICE FOR THERMAL AND MECHANICAL PROTECTION OF OBJECT | 2004 |
|
RU2269166C1 |
PROTECTIVE DEVICE | 2004 |
|
RU2269168C1 |
ONBOARD PROTECTIVE DEVICE | 2004 |
|
RU2269165C1 |
PROTECTIVE DEVICE FOR MICROELECTRONIC OBJECT | 2004 |
|
RU2269167C1 |
ONBOARD UNIT FOR THERMAL AND MECHANICAL PROTECTION OF OBJECT | 2004 |
|
RU2263980C1 |
ONBOARD PROTECTIVE DEVICE FOR MICRO-ELECTRONIC OBJECTS | 2004 |
|
RU2281230C2 |
ONBOARD DEVICE FOR PROTECTING MICROELECTRONIC OBJECT | 2004 |
|
RU2273895C1 |
METHOD OF ELECTRONIC MODULES THERMAL PROTECTION | 2015 |
|
RU2610715C1 |
Authors
Dates
2006-01-20—Published
2004-07-07—Filed