FIELD: devices for protection of micro-electronic equipment against external mechanical and thermal action; onboard information storage for aircraft and helicopters, as well as diesel locomotives, ships, automobiles.
SUBSTANCE: proposed device consists of external impact- and heat-resistant layer, intermediate and internal heat-protective layers located in succession. External impact- and heat-resistant layer is made from heat-resistant metals. Intermediate heat-protective layer is made from refractory porous material. Inner heat-protective layer is formed from water-containing material. Outer surface of external impact- and heat-resistant layer is provided with bimorphous heat-protective coat molded from heat-insulating composite material. This coat possesses adhesion to surface of external impact- and heat-resistant layer and has ability to increase its volume by 10 times when flame acts on it. External impact- and heat-resistant layer is provided with through drain holes. Ratio of diameter of each hole to thickness of external layer is more than 0.1 and does not exceed 0.5. Amount of drain holes is equal to one or two per cm2 of its layer. Proposed device ensures protection of micro-electronic object against mechanical and thermal loads including all-round action of high temperature of 1100°C continued for an hour and protracted all-round action of high temperature of 260°C continued for 10 h.
EFFECT: enhanced efficiency.
1 dwg
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Authors
Dates
2006-08-10—Published
2004-09-21—Filed