FIELD: electrical engineering; cooling electronic device components.
SUBSTANCE: proposed heat sink designed for use in closed-circuit evaporative cooling systems of electronic devices wherein vacuum is maintained has one or more hollow panels with planar or corrugated surfaces tightly joined at ends; disposed between external surfaces of panels are partitions that function to prevent closure between their surfaces under impact of atmospheric pressure and to divide inner space of panels into hollow cells easily intercommunicating through their openings. High resistance of apparatus to impact of external pressure is ensured by great number of internal partitions in spite of their small thickness. Easy heat transfer through external walls even when structural materials of low heat conductivity and high engineering, design, and anticorrosive characteristics, such as plastics, are used for partitions and case is attained with small thickness of external walls. Small thickness of heat sink makes it possible to dispose the latter along room walls which takes small space requirement at the same time affording large heat-transfer surface.
EFFECT: reduced metal input and simplified configuration of heat sink external surface while retaining large heat-transfer area.
4 cl, 1 dwg
