FIELD: mechanical engineering.
SUBSTANCE: invention relates to heat exchange devices on base of heat pipes which can be used for cooling electronic devices, electrical and power sets. Proposed device contains cooling set, liquid circuit and heater. Connected by common volume to form two-layer heat panel-radiator with pyramidal convex-concave cells arranged in staggered order. It includes also thermoelectric refrigerator rigidly attached to said panel-radiator over entire surface. Liquid circuit contains branches of branches of loop heat pipes connected by condensate tubes to evaporators and by evaporating tubes, to condensers of heat pipes of said panel-radiator. Hydroaccumulator with heat carrier is provided which communicates with panel-radiator through tube with wick. Thermoelectric heater is connected to its outer surface, being provided with system of heat sensors of cooled set and its parts. Said sensors are connected through electronic amplifiers of control system with heater electric supply source. Device can be used for cooling either entire set or its separate units.
EFFECT: increased heat transfer coefficient, enlarged range of tolerable thermal power of cooled set and dynamic tracking of its changes, elimination of noises and vibrations at operation of cooling device.
3 dwg
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Authors
Dates
2006-12-27—Published
2005-02-03—Filed