HEAT-TRANSFER DEVICE FOR COOLING ELECTRONIC COMPONENTS Russian patent published in 2017 - IPC F28D15/00 

FIELD: heating system.

SUBSTANCE: device can be used mainly in the cooling systems of electronic components, such as microprocessors, CPUs, chips, memory modules in computers, etc., including those having two or more components with varying capacity, requiring cooling, spaced from each other and from heat sink: air, liquid or another heat exchanger. The heat-transfer device for cooling electronic components comprises a cooling circuit in the form of a loop heat pipe, includes an evaporator with capillary structure inside, which provides thermal contact with the most powerful heat source, a capacitor communicating through a hollow steam pipe and condensate pipe with the evaporator, that differs in the fact that the device contains one capacitor connected with external heat exchanger fulfilling the role of a heat sink and carrying the heat received from all heat sources outwards, and the condensate pipe contains at least one heat exchanger made in the form of a condensate pipe connected with a contact plate that provides thermal contact with a less powerful heat source located directly between the evaporator and the condenser.

EFFECT: increased operation resistance of the device, simplified manufacture and assembly, reduced labour intensity, improved heat transfer efficiency simultaneously from two or more electronic components, which dissipate heat flows, varying up to 10 times or more, and are arbitrarily located in space, possibility of placing it in space-limited environment.

14 cl, 10 dwg