FIELD: cooling and thermal stabilization systems.
SUBSTANCE: invention relates to the field of cooling and thermal stabilization systems of devices heated during operation, which require continuous long-term maintenance of operating temperature with high accuracy. Universal cooling and thermal stabilization system comprises heat exchangers arranged in housing 1, temperature sensors 10, pumps 4, heat carrier tank 5, power supply 6, control unit 7, pressure sensor 18, inlet and outlet openings 22, 23, valves 19, 20, 21. System is equipped with heat exchange modules 2, collector 3 and switching unit 8, each heat exchange module contains coolers installed on heat exchanger, thermal interface and thermoelectric modules, temperature sensors 10 are installed on heat exchanger and collector 3 and connected to control unit 7, inlet 22 is connected to input collector 3, openings of which are connected to openings of heat exchangers, outlet of collector is connected to tank 5 connected to series-connected pumps 4, the last of which is connected to outlet opening 23, sides with larger area of heat exchangers are arranged parallel to base of housing, each thermoelectric module is arranged along to the centre of the radiator of each cooler in the clamping frame with a uniform gap along the contour; the coolers are located on both sides of the heat exchangers.
EFFECT: cooling of devices with released thermal power up to 300 W in wide range of operating temperature of system heat carrier.
2 cl, 7 dwg
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Authors
Dates
2024-10-09—Published
2024-04-17—Filed