FIELD: electric engineering, in particular, devices for cooling microcircuits of VGA graphic video adapter card.
SUBSTANCE: two variants of realization of device for cooling microcircuits of VGA graphic video adapter card are suggested, in each variant aforementioned device contains two heat sinks, mounted on corresponding opposite surfaces of VGA card to provide combined cooling for VGA card microcircuit. In device for cooling microcircuit of VGA card, two heat sinks are mounted on opposite surfaces of electronic board of VGA card, respectively, and are interconnected by means of a heat pipe. In particular, connecting section between heat sink in contact with VGA card microcircuit and heat pipe is always installed at lower level compared to section of connection between the other heat sink positioned in front of it and the heat pipe, serving to additionally improve heat conductance characteristic of heat pipe. Usage of two heat sinks for combined cooling of microcircuit, and also specifics of realization of heat pipe and of connection of its end sections to heat sinks result in increased efficiency of graphic video adapter card microcircuit cooling compared to usage of one heat sink.
EFFECT: increased efficiency.
2 cl, 30 dwg
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Authors
Dates
2007-06-10—Published
2003-04-03—Filed