FIELD: electronic equipment.
SUBSTANCE: invention relates to cooling of electronic device containing electronic compartment formed by housing and at least one electronic board fitted in housing. Proposed board (1) is made for installation with possibility if dismantling in housing (10) by its movement along slot (13, 13a) till operating position is reached, whereupon installation of board is carried out through surface (17) of housing insert (10). Device comprises heat sink (20) of elongated shape, arranged along slot (13, 13a) ensuring withdrawal of heat emitted by components (12), and facility (25, 30) for heat extraction withdrawn by heat sink (20), besides, facilities (25, 30) of withdrawal are located outside of electronic compartment, or at the level of insert surface (17), or at the level of rear surface (18) opposite to insert surface (17).
EFFECT: ensuring the same reduced time for replacement of board, whether it is equipped with or not special cooling means.
11 cl, 7 dwg
| Title | Year | Author | Number |
|---|---|---|---|
| THREE-DIMENSIONAL ELECTRON MODULE | 1997 |
|
RU2133523C1 |
| SYSTEM OF CONDUCTIVE HEAT REMOVAL FROM ELECTRONIC MODULES OF MAIN-MODULAR FORM FACTOR FOR PACKAGE ELECTRONICS PRODUCTS | 2023 |
|
RU2820075C1 |
| 3D ELECTRONIC DEVICE | 2011 |
|
RU2488913C1 |
| DEVICE FOR HEAT REMOVAL FROM FUEL COMPONENTS | 2015 |
|
RU2586620C1 |
| PRINTED CIRCUIT BOARD COMPRISING AT LEAST ONE CERAMIC COMPONENT | 2011 |
|
RU2608587C2 |
| LIQUID COOLING SYSTEM FOR MULTIPROCESSOR COMPUTATION COMPLEX, PACKAGE AND HEAT SINK MODULE | 2013 |
|
RU2522937C1 |
| ELECTRIC RADIATOR USING CALCULATING PROCESSORS AS HEAT SOURCE | 2010 |
|
RU2556952C2 |
| SYSTEM OF CONDUCTIVE HEAT REMOVAL FROM ELECTRONIC MODULES OF STACK FORM FACTOR FOR HOUSING ELECTRONICS PRODUCTS | 2017 |
|
RU2713486C2 |
| CONNECTOR FOR CONNECTION OF COMPONENT TO HEAT SINK | 2010 |
|
RU2571194C2 |
| DEVICE TO REMOVE HEAT FROM HEAT RELEASING COMPONENTS | 2013 |
|
RU2546963C1 |
