SYSTEM FOR HEAT REMOVAL OF MODULES OF COMPUTER SYSTEM OF HIGHWAY-MODULAR ARCHITECTURE Russian patent published in 2024 - IPC G06F1/20 H05K7/20 

FIELD: heat exchange.

SUBSTANCE: invention relates to a system of heat removal from modules of a computer system of a highway-modular architecture, which is intended for use in systems with conductive heat removal from modules. Technical result is achieved by the fact that the system contains a contour heat pipe, evaporator of which is fixed in the processor heat distribution plates, fixed using a spring suspension to the radiator, the profile of which is made taking into account the heights of the components of the electronic module, from which heat removal is provided. Condenser part of the heat pipe is fixed on the base of the radiator, on the reverse side of which wedge-shaped clamps are fixed. In addition, additional heat-distributing plates are provided in the heat pipe circuit. Heat-distributing plates of the processor and additional heat-distributing plates are located on the radiator in places of arrangement of the module and additional microcircuits with high heat release. Heat dissipating elements of the unit of module elements by using thermal paste adjoin the body of the product in the places of installation of the processor plate and additional plates. Heat from the processor is supplied to the plates and then to the evaporator of the loop heat pipe. Further, heat is transferred from the evaporator to the condensation area, which is located in the area of wedge-shaped clamps of the module. When the module is installed into the housing with fixation of the module using wedge-shaped clamps, heat is transferred to the housing through the wedge-shaped clamps.

EFFECT: creation of a system for heat removal from heat-dissipating elements of computational modules of highway-modular architecture, which is highly efficient, compact and meets specified parameters in terms of manufacturability, reliability, resistance to external factors.

6 cl, 4 dwg