GLUING CURRENT-CONDUCTING COMPOSITION Russian patent published in 2007 - IPC C09J9/02 C09J163/02 

FIELD: gluing compositions and materials.

SUBSTANCE: invention relates to a gluing current-conducting composition designated for fixing articles and providing electric hermeticity in wave-guide systems of electronic engineering technique. The composition comprises components taken in the following ratio, mas. p. p: epoxydiane resin ED-20, 90-110; low-molecular polyamide resin L-20, 55-65; nickel powder of sort PNK-1L5, 500-600; technical cyclohexanone as a solvent, 80-120; titanium-organosilicon oligomer of cross-shaped structure of the general formula: Ti{[OSi(CH₃)(C₆H₅)]_2-5OH}₄ representing product of TMPhT (tetrakis (methylphenylsiloxanehydroxy) titanium). Invention provides enhancing heat stability, increasing electric hermiticity of wave-guides and decreasing coefficient of stationary wave in wave-guide devices.

EFFECT: improved and valuable properties of composition.

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