FIELD: chemistry.
SUBSTANCE: electroconductive adhesive contains epoxy resin modified with an organosilicon compound in furyl glycidyl ether as binder, polyaminoamide as a hardener, nickel carbonyl powder modified with an amine as filler.
EFFECT: invention increases adhesion strength of electroconductive adhesive during shearing owing to fewer defects in the adhesive joint, use of nickel carbonyl powder modified with an amine ensures uniform distribution of particles in the volume.
1 tbl
Title | Year | Author | Number |
---|---|---|---|
ADHESIVE EPOXIDE COMPOUND | 2011 |
|
RU2457231C1 |
GLUE EPOXIDE COMPOSITION | 2004 |
|
RU2269561C1 |
CURRENT-CONDUCTING ADHESIVE COMPOSITION | 2005 |
|
RU2308105C1 |
GLUING CURRENT-CONDUCTING COMPOSITION | 2006 |
|
RU2304159C1 |
NANOMODIFIED COLD-CURING ELECTROCONDUCTIVE ADHESIVE COMPOSITION | 2018 |
|
RU2688573C1 |
HEAT-RESISTANT ADHESIVE COMPOSITION | 2003 |
|
RU2238294C1 |
HEAT RESISTANT ADHESIVE COMPOSITION | 1992 |
|
RU2061727C1 |
HEAT RESISTANT GLUE COMPOSITION OF COLD HARDENING | 2007 |
|
RU2368635C2 |
ELECTROCONDUCTIVE GLUE | 0 |
|
SU666192A1 |
GLUE COMPOSITION FOR TENSORESISTOR GLUEING | 1990 |
|
RU1818832C |
Authors
Dates
2012-11-10—Published
2011-05-26—Filed