CIRCUIT BOARD AND METHOD FOR MUTUAL CONNECTION OF MOUNTING PLATES Russian patent published in 2007 - IPC H05K1/14 H05K1/18 H01R12/00 

Abstract RU 2308178 C2

FIELD: circuit boards comprising connected and held together mounting plates, on which interconnection layout is formed, such as flexible electronic board and rigid electronic board, installed in electronic devices, used primarily in electric equipment and communication devices, and also method for mutual connection of mounting plates.

SUBSTANCE: circuit board device consists of first and second mounting plates and anisotropic conductive element. First mounting plate is provided with rows of first separate connecting contacts on its surface layer. Second mounting plate is provided with rows of second separate connecting contacts on its surface layer. Anisotropic conductive element is positioned between first and second mounting plates in a way making possible to mutually connect respectively separate contacts. Local section of each mounting plate is made stepped for separate positioning of electrode contacts. The local section of anisotropic conductive element is made stepped to ensure possible contact with corresponding stepped sections of mounting plate. The multi-layered structure, consisting of mounting plates and anisotropic conductive element which is positioned between mounting plates, is held together by pressure in the direction of superposition.

EFFECT: creation of circuit board device, which may connect mounting plates, on which in matrix configuration a set of connecting electrode contacts is positioned and which may be dismounted, and which device is simple to manufacture for realization of greater thinning and saving of space, and also creation of method for mutual connection of mounting plates.

2 cl, 23 dwg

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RU 2 308 178 C2

Authors

Sato Dzunia

Khasimoto Josijuki

Koizumi Masakazu

Dates

2007-10-10Published

2004-01-22Filed