FIELD: organic semiconductors.
SUBSTANCE: embossing or laminating film has at least one circuit component manufactured by using organic semiconductor technology, for instance one or more organic field-effect transistors; circuit component has several layers including electric functional layers with at least one organic semiconductor layer, at least one insulating layer, and electricity conductive layers. One or more layers of circuit component are made by way of thermal or ultraviolet replication including spatial structuring, part of at least one electric functional layer in spatial structuring region being fully separated.
EFFECT: improved circuit component production process using organic semiconductor technology.
28 cl, 9 dwg
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