SOLDERING METHOD OF LEAD-FREE ELECTRIC RADIO COMPONENTS TO PRINTED CIRCUIT BOARD Russian patent published in 2007 - IPC B23K1/00 H05K3/34 

FIELD: radio engineering, instrument making, electronic and electrical engineering industry branches.

SUBSTANCE: method comprises steps of preliminarily drying electric radio components; applying flux onto places for mounting components in printed circuit board and drying it in air for 10 - 15 min; simultaneously heating for 20 -25 min electric radio components and printed circuit board till temperature that differs from melting temperature of solder by 100 -150°C; then placing components onto respective sites on printed circuit board and soldering them for 2 - 3 s.

EFFECT: improved operational reliability of components due to enhanced quality of soldered joints.

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