SOLDER PASTE Russian patent published in 2016 - IPC B23K35/24 B23K35/363 

FIELD: instrument making.

SUBSTANCE: invention can be used for surface mounting. Solder paste contains the following component ratio, wt%: colophony 4.0-5.0, oxy derivative compound of alkylamines row - 3.7-4.3, polyethylene glycol with molecular weight of 1,500-20,000 - 2.9-3.2, ethylene glycol - 1.2-1.5, sodium hydroxide - 0.5-0.7, solder powder is balance.

EFFECT: solder paste possesses high accuracy of proportioning and degree of retention of solder in weld, as well as provides complete washing residues of flux with water.

4 cl, 2 tbl