SOLDER PASTE Russian patent published in 2012 - IPC B23K35/36 B23K35/363 B23K35/26 

FIELD: chemistry.

SUBSTANCE: invention can be used for surface mounting of radio components and integrated circuits on printed-circuit boards. The solder paste contains 80-91 wt % solder alloy powder and 9-20 wt % flux-binder. The flux-binder has components in the following ratio in wt %: synthetic resin based on natural components 30-60, mixture of organic solvents in form of esters 30-60, activators in form of a mixture of organic acids 1-8, a rheologic additive in form of plant wax carnauba 1-15. Substances contained in the solder are environmentally safe, are based on natural biodegradable material which is not harmful to the environment, have very low or do not have any smell at all, do not contain amines, surfactants and water. After soldering with the solder paste, flux residue at the soldered joint contain a minimum number of ions, which provides high surface electrical resistance for a long period.

EFFECT: paste enables formation of reliable and quality soldered joints for work in severe operating conditions.

6 dwg, 4 tbl, 1 ex