METHOD FOR METALLIZATION OF OPENINGS IN MULTI-LAYERED ELECTRONIC BOARDS Russian patent published in 2008 - IPC H05K3/00 

FIELD: electronics, manufacturing of electronic boards, may be used for manufacturing microchips.

SUBSTANCE: method for metallization of openings in multi-layered electronic boards includes degreasing and pickling of template, its processing in solution of chemical silver on basis of potassium ferrocyanide and potassium thiocyanite, sensitization in solution of tin chloride, activation in solution of palladium chloride, chemical copper coating, galvanic copper coating and thermo-diffusion processing in argon environment with stepped temperature increase. To improve reliability of inter-layer connections, method features galvanic copper coating in fluoboric electrolyte at normal temperature (≈20°) and stepped increase of temperature during thermo-diffusion processing in argon environment performed in following modes: (20±1)°C over 100 hours; (30±1)°C over 88 hours; (40±1)°C over 70 hours; (50±1)°C over 67 hours; (60±1)°C over 63 hours; (70±1)°C over 55 hours; (80±1)°C over 51 hours; (90±1)°C over 44 hours; (100±1)°C over 38 hours; (110±1)°C over 31 hours; (120±1)°C over 16 hours; (130±1)°C over 6,3 hours; (140±1)°C over 3 hours; (150±1)°C over 1,7 hours and (160±1)°C over 0,4 hours.

EFFECT: increased reliability of inter-layer connections in multi-layered electronic boards, reduced duration of electronic board manufacturing cycle and reduced laboriousness of technological process.