METHOD FOR ELECTROCHEMICAL METALLIZATION OF PRINTED-CIRCUIT BOARD HOLES Russian patent published in 1997 - IPC

Abstract RU 2084087 C1

FIELD: electronic and radioelectronic engineering. SUBSTANCE: foiled insulating base with holes is activated in copper hypophosphite base solution, subjected to heat treatment at 100-135 C for 7-15 minutes, rinsed, and metal layer is electrically built up. Calcium hypophosphite is additionally introduced in activating solution up to supersaturation of solution wherein is also added aqueous solution of 25% 1,4-butadiol within 0.22-0.37 ml per gramm of copper in solution; after heat treatment, conducting layer is fused at 140-170 C for 4-8 minutes. EFFECT: facilitated procedure. 2 tbl

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RU 2 084 087 C1

Authors

Lomovskij O.I.

Fadeev E.I.

Fadeev V.E.

Dates

1997-07-10—Published

1993-06-15—Filed