METHOD OF ELECTROCHEMICAL METALLIZATION OF HOLES IN PRINTED CIRCUIT BOARDS Russian patent published in 1994 - IPC

Abstract RU 2019925 C1

FIELD: printed circuit boards industry. SUBSTANCE: surfaces of foil are cleaned after thermal treatment of workstocks activated in solution of palladiumless metallization by means of anode solution of products of thermal decomposition of copper hypophosphite for the course of 2-5 min with initial anode density of current 4-5 A/sg.dm. After this workstock is kept additionally for 1-2 min in electrolyte without current and is washed with water. EFFECT: simplification and intensification of process. 2 cl, 1 tbl

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RU 2 019 925 C1

Authors

Fadeev Е.I.

Revzin G.Е.

Lomovskij О.I.

Dates

1994-09-15Published

1991-07-08Filed