FIELD: electrical engineering; highly stabilized oscillation sources; temperature-controlled oscillators incorporating piezoelectric resonators.
SUBSTANCE: piezoelectric resonator case made of high-conductivity material ensuring uniform temperature field throughout entire plane of piezoelectric wafer at ambient temperature variations functions as heat-distributing chamber of proposed device. Oscillator has external hermetically sealed housing with cover that mounts first printed-circuit board carrying circuit components whose temperature is not controlled and piezoelectric resonator case. Temperature-controlled components of oscillator circuit and piezoelectric resonator case are disposed on opposite main edges of second printed-circuit board secured on heat-insulated spacer provided with recesses to receive resonator case. Space between inner surface of external housing cover and oscillator circuit components is filled with material of low heat conductivity.
EFFECT: reduced mass and size of device at high frequency stability within wide temperature range.
1 cl, 2 dwg
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Authors
Dates
2008-04-27—Published
2006-12-08—Filed